1. 2. 3. material content data sheet sales product name bfp 620 h7764 issued 29. august 2013 ma# MA000808554 package pg-sot343-4-2 weight* 6.93 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.003 0.04 421 non noble metal tin 7440-31-5 0.001 0.01 109 inorganic material silicon 7440-21-3 0.017 0.24 0.29 2449 2979 leadframe inorganic material silicon 7440-21-3 0.001 0.01 100 non noble metal titanium 7440-32-6 0.003 0.05 498 non noble metal chromium 7440-47-3 0.010 0.15 1493 non noble metal copper 7440-50-8 3.433 49.56 49.77 495597 497688 wire noble metal gold 7440-57-5 0.010 0.14 0.14 1427 1427 encapsulation organic material carbon black 1333-86-4 0.030 0.44 4379 plastics epoxy resin - 0.652 9.42 94154 inorganic material silicondioxide 60676-86-0 2.351 33.94 43.80 339393 437927 leadfinish non noble metal tin 7440-31-5 0.199 2.88 2.88 28760 28761 plating noble metal silver 7440-22-4 0.216 3.12 3.12 31220 31220 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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